Authors:
- Describes packaging design for high power semiconductor lasers
- Details prevention techniques for thermal stress failures
- Discusses most recent technology trends in semiconductor laser packaging
Part of the book series: Micro- and Opto-Electronic Materials, Structures, and Systems (MOEM)
Buy it now
Buying options
Tax calculation will be finalised at checkout
Other ways to access
This is a preview of subscription content, log in via an institution to check for access.
Table of contents (11 chapters)
-
Front Matter
-
Back Matter
About this book
Authors and Affiliations
-
Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences, Shaanxi, China
Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
About the authors
Bibliographic Information
Book Title: Packaging of High Power Semiconductor Lasers
Authors: Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
Series Title: Micro- and Opto-Electronic Materials, Structures, and Systems
DOI: https://doi.org/10.1007/978-1-4614-9263-4
Publisher: Springer New York, NY
eBook Packages: Energy, Energy (R0)
Copyright Information: Springer Science+Business Media New York 2015
Hardcover ISBN: 978-1-4614-9262-7Published: 15 July 2014
Softcover ISBN: 978-1-4939-5590-9Published: 01 October 2016
eBook ISBN: 978-1-4614-9263-4Published: 14 July 2014
Series ISSN: 2626-2371
Series E-ISSN: 2626-238X
Edition Number: 1
Number of Pages: XV, 402
Number of Illustrations: 111 b/w illustrations, 386 illustrations in colour
Topics: Energy Systems