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ISLPED '04: Proceedings of the 2004 international symposium on Low power electronics and design
ACM2004 Proceeding
Publisher:
  • Association for Computing Machinery
  • New York
  • NY
  • United States
Conference:
ISLPED04: International Symposium on Low Power Electronics and Design Newport Beach California USA August 9 - 11, 2004
ISBN:
978-1-58113-929-7
Published:
09 August 2004
Sponsors:
Next Conference
August 5 - 7, 2024
Newport Beach , CA , USA
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Abstract

Welcome to the 2004 International Symposium on Low Power Electronics and Design (ISLPED)!

This year ISLPED moves back to California after a very successful year in Asia. ISLPED started as a workshop on low-power design in 1994 and is in its tenth year. This year we received papers in all aspects of low-power design from all over the world. This indicates the continuous international interest across the VLSI electronics community for low power design. Indeed, unique to ISLPED is that it brings together researchers from academia and industry with different backgrounds in technology, circuits, micro-architectures and architectures, digital and analog design, system design and software, having one common research concern: power-efficient design. We believe that this critical attribute of ISLPED continues to hold true even as power issues become more central in broader conferences such as ISSCC, DAC and ISCA. ISLPED provides a forum for lively exchange of ideas that span multiple disciplines and yet are aimed at solving the same challenge.

This year we received 204 submissions. Many thanks to all the authors who submitted papers: their work is the reason this symposium has become so successful. We were able to accept a total of 70 contributions (34% acceptance): 56 regular papers, and 14 poster papers. Regular papers have 6 pages in the proceedings while poster papers have 4 pages in the proceedings. The circuits and technology areas continue to be well represented, while micro-architecture, platform and software areas continue to see rapid growth in interest. We also have an excellent program of keynote, plenary, and embedded tutorial speakers. The embedded tutorials address some key new issues that have come to the forefront as we continue to scale down on feature and transistor sizes. It's the tyranny of the small -- effects that once were relegated as second-order e.g. leakage and manufacturing variations, are now macro effects that determine key attributes of high-performance designs. The keynote and plenary speakers bring a wealth of industry experience and are at the forefront of the battle against power consumption -- at the transistor, architecture and platform levels. The winners of the student design contest have a special session on Tuesday morning (their papers are not included in the proceedings). An industry sponsored cash award will be presented to each selected design entry.

Many thanks to the Technical Program Committee for all the hard work in the paper review, paper selection and session organization. The technical program committee also had the help of additional reviewers. We would also like to thank them for their contribution. This year we had a blind-review process which worked very well. The technical program committee met in April on the UC-Irvine campus. Even with economic constraints, we had a very large attendance. Thanks for your commitment to the symposium. Also thanks to the members of the organizing committee for all their hard work behind the scenes: Vijay Narayanan as Treasurer, Payam Heydari as Local Arrangements Chair, Mahmut Kandemir and Jihong Kim as Publicity Chairs, David Scott as Design Contest Chair, Diana Marculescu as Exhibits Chair. Thanks to Swarup Bhunia and Animesh Datta for taking care of the web-based paper submission. The symposium has received generous financial support from Intel, Texas Instruments, Synopsys, Sequence Design, IBM, Magma Design Automation, and Cadence.

We would especially like to acknowledge the financial support from <i>University of California's Industry-University Cooperative Research Program</i>. This financial support was critical in helping reduce the symposium registration fees.

ISLPED is sponsored by ACM SIGDA and the IEEE Circuits and Systems Society. It receives technical co-sponsorship from the IEEE Solid State Circuit Society and the IEEE Electron Devices Society. Finally, we would like to thank you, the audience and the reader for your interest and support of this symposium. We hope that you will find the symposium both stimulating and helpful. We appreciate your comments and suggestions.

Article
Why hot chips are no longer "cool"

Chip and system designers are battling a two front war -- extracting the last advantages from traditional semiconductor technology scaling on one front, while simultaneously working to contain skyrocketing chip power budgets on the other front. The ...

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Balanced energy optimization

Energy efficiency is now the number one issue for many applications, determining weight and cost, and constraining system performance. Many techniques have been developed to minimize the dynamic and static power consumed by digital designs without any ...

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Battery life challenges on future mobile notebook platforms

With the introduction of Intel® CentrinoTM Mobile Technology in 2003, Intel redefined mobile computing to deliver the outstanding mobile performance, integrated wireless capability, while enabling extended battery life and thin & light designs that end ...

Article
Managing standby and active mode leakage power in deep sub-micron design

Scaling has allowed rising transistor counts per die and increases leakage at an exponential rate, making power a primary constraint in all integrated circuit designs. Future designs must address emerging leakage components due to direct band to band ...

Article
Understanding nanoscale conductors

It is common to differentiate between two ways of building a nanodevice: a top-down approach where we start from something big and chisel out what we want and a bottom-up approach where we start from something small like atoms or molecules and assemble ...

Article
The impact of variability on power

The integrated circuit manufacturing process has inevitable imperfections and fluctuations that result in ever-growing systematic and random variations in the electrical parameters of active and passive devices fabricated. The impact of such variations on ...

Contributors
  • IBM Thomas J. Watson Research Center
  • Seoul National University
  • Princeton University
  • Purdue University

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      Acceptance Rates

      Overall Acceptance Rate398of1,159submissions,34%
      YearSubmittedAcceptedRate
      ISLPED '161906032%
      ISLPED '141846334%
      ISLPED '092087235%
      ISLPED '032219041%
      ISLPED '021624025%
      ISLPED '011947338%
      Overall1,15939834%